Samsung Electronics Co., a world leader in advanced component solutions, introduced a new lineup of flip chip LED packages and modules offering enhanced design flexibility and a high degree of reliability. The new offerings, for use in leading-edge LED lighting such as LED bulbs, MR/PAR and downlights, will be available in the market during the second quarter of this year.

“By utilizing an advanced flip chip technology, Samsung has made significant improvements to its LED packages and modules,” said Bangwon Oh, senior vice president, LED strategic marketing team, Samsung Electronics. “Our new Samsung FC and FCOM solutions also strengthen our overall line-up of LED component solutions, further enhancing our market competitiveness.”

Samsung's new high power LED package (LH141A). (LEDinside/Samsung)

Samsung’s new flip chip (FC) LED package and flip chip on module (FCOM) solutions feature highly efficient and versatile LED structures, created by flipping over blue LED chips and adhering phosphor film to each of them. Unlike conventional LED packages that dispense phosphor and then place a plastic mold over each chip, Samsung’s FC package technology can produce LED packages down to a chip-scale size without any mold, enabling more compact lighting fixture designs. 

Samsung’s new FC and FCOM series can be driven at a current higher than that of conventional LED components, and have low thermal resistance. The low thermal resistance improves the reliability of the FC and FCOM solutions, resulting in higher flux, and a decrease in the number of packages needed, plus a reduction in the size of the circuit board.

Also, by attaching a cell film, each package gains uniform thickness and lower color deviation. As a result, the FC and FCOM solutions provide a high level of color consistency and ensure the chromaticity control of MacAdam 3-step ellipses.

The new FC and FCOM LED solutions include a middle power LED package (LM131A), a high power LED package (LH141A) and an LED downlight module, all featuring the new Samsung flip chip technology.

Flip chip middle power LED package (LM131A) and high power LED package (LH141A)

Samsung’s LM131A and LH141A flip chip packages feature exceptionally compact form factors of 1.22x1.22 millimeters and 1.4x1.4mm, respectively. By excluding a plastic mold, the two packages can function at a high current level in a highly reliable manner, even after long hour of use. These advantages make them ideal for use in LED lighting applications requiring a small form factor with high light output, including LED bulbs and spotlight products such as MRs and PARs.

In addition, the use of a phosphor film assures color quality that satisfies the MacAdam 3-step.

Samsung's new flip chip on module (FCOM) for LED downlight fixtures. (LEDinside/Samsung)

Flip chip on module (FCOM) for LED downlight fixtures

Samsung’s new FCOM downlight products are distinguished by their high light output. Compared to a chip-on-board (COB) engine, which has a fixed wattage, the new FCOM permits simple adjustments in the number of FC LED packages to make the module compatible with a variety of electrical drivers of different wattages, in allowing greater design flexibility.

To create a downlight with 1000lm output and 100lm/W efficacy, Samsung FCOMs require a 1.7x1.7 centimeter circuit. Such a small form factor makes these FCOMs well-suited for size-sensitive LED lighting applications, which include LED bulbs, MR/PAR spotlights, downlights and even cove lighting.

Samsung’s FCOMs satisfy the MacAdam 3-step and can support MacAdam 2-step depending on customer needs, thanks to the superb color consistency of the chips and a rating of at least 80 on the color rendering index (CRI). The new Samsung FCOMs also offer a range of correlated color temperature (CCT) – from 2700K to 5000K.

All of these new LED solutions will be showcased at the Light and Building trade fair being held in Frankfurt, Germany, March 30 - April 4, along with a wide variety of other Samsung LED component solutions. (Booth B04 in Hall 6.2)